A High Vacuum Magnetron Ion Sputtering Coater is a thin-film deposition system that uses magnetron sputtering under high-vacuum conditions to coat substrates with metals, ceramics, semiconductors, or insulating materials. It provides stable, precise, and contamination-free coatings for research and industrial applications.  It is easy to operate and user friendly. Manual control version (cost-effective) is available for order. 

Key Features:

• Magnetron Sputtering Principle: A target material (metal, ceramic, etc.) is bombarded with ions in a plasma. The atoms ejected from the target are deposited as a thin film on the substrate.
• High Vacuum Environment: The chamber is evacuated to very low pressures (down to 5×10−4Pa), minimizing contamination and ensuring uniform film quality.
• Ion Assistance: Ion bombardment improves adhesion and density of the deposited film.
• Thickness monitor is available upon request (optional)
• A vacuum Pump and one Chiller are included
• DC/RF Power Options:
• DC (Direct Current) – Used for conductive materials like metals.
• RF (Radio Frequency) – Enables sputtering of non-conductive materials such as ceramics or polymers
• DC + RF: combo of DC and RF

Typical Applications:

• SEM/TEM Sample Preparation – Coating non-conductive samples with gold or carbon to prevent charging.
• Thin-Film Research – Creating functional coatings for optics, electronics, and sensors.
• Surface Engineering – Improving hardness, wear resistance, or conductivity of materials.
• Nanotechnology – Fabricating nanoscale films for advanced devices.