Precision Machining
- Device design and prototyping
- Contract device manufacturing
- Device metrology and QC
- Full solution (including components and modules)
- Fluidic interface design and manufacturing
- Design for manufacturability, reliability and serviceability
The options of substrate materials may include silicon, glass (fused silica, quarts, borosilicate and photosensitive glass), thermoplastics (table below), and hybrid materials (CaF2, stainless steel etc.). The fabrication techniques will be coined according to the design complexity and substrate material properties. We provide both enclosed microfluidic chips and/or microfluidic layers for subsequent surface treatment. Awesome Pricing and Flexibility on Small Quantities: small volume manufacturing from a few to
up to thousands of units is available before the transition to the large
scale production.
Chip General Information | |
Standard Chip Size | 75 mm x 25 mm x 1.5 mm |
Chip Material Option | Thermoplastics (COC/COP, PC, PS, PP and PMMA) |
Mold Minimum Feature Size | 2 µm (diameter of inner corner) |
Through-hole Size | Typical 0.5-0.8 mm |
Micro-channel Feature | |
Channel Width Range | ≥ 10 µm |
Channel Height Range | ≤ 300 µm |
Channel High Aspect Ratio | ≤ 3 |
Channel Dimension Tolerance | ±10% |
Channel Surface Roughness | 5-10 nm (Ra) |
Complex Features | Multiple depths on a single layer |
Chip Bonding Techniques | |
Bonding Process Available | Ultrasonic welding, laser welding, thermal fusion and adhesive |
Alignment Tolerance | Typical +/- 10 µm |
Multiple Layer Capability | Typical 2-Layer and 3-Layer |
Surface Treatment Option | |
Hydrophilic Treatment | Yes, typical contact angle 10 to 30° (duration depends on process) |
Hydrophobic Treatment | Yes |
Fluorophilic | Yes |
Other Features and Options | |
Chip Metalization | Electrodes or electronic connectors fabricated on chip |
Micro Pillar Array | 20 um < dimension < 100 um, ±15% tolerance |
Manufacturing Capability | |
Manufacturing Capability Per Year | 50, 000, 000 chips |
Small Volume Option | 10-2000 chips |
Fabrication Turnaround Time | 8-10 weeks (4-6 weeks for small volume) |
ISO QC Certificate | ISO 9001, ISO 13485/GMP |
Tags Microfluidic, Microfabrication, Injection Molding, Laser Micromachining