Precision Machining

Building a practical microfluidics system requires more than microfluidic devices/chips alone. Product development services can often involve the integration of fluidics and thermal management systems along with other technologies, such as electrodes, thin film heating elements and optic lens or other sensing elements. According to the application requirements from customers, Aurora Pro Scientific will assist you from early stage research through to process controlled manufacturing of integrated microfluidic components and modules by selecting appropriate micro fabrication techniques and materials to realize the benefits of microfluidics. We provide:

Device design and prototyping
Contract device manufacturing
Device metrology and QC
Full solution (including components and modules)
Fluidic interface design and manufacturing
Design for manufacturability, reliability and serviceability

The options of substrate materials may include silicon, glass (fused silica, quarts, borosilicate and photosensitive glass), thermoplastics (table below), and hybrid materials (CaF2, stainless steel etc.). The fabrication techniques will be coined according to the design complexity and substrate material properties. We provide both enclosed microfluidic chips and/or microfluidic layers for subsequent surface treatment. Awesome Pricing and Flexibility on Small Quantities: small volume manufacturing from a few to up to thousands of units is available before the transition to the large scale production.

Chip General Information
Standard Chip Size	75 mm x 25 mm x 1.5 mm
Chip Material Option	Thermoplastics (COC/COP, PC, PS, PP and PMMA)
Mold Minimum Feature Size	2 µm (diameter of inner corner)
Through-hole Size	Typical 0.5-0.8 mm
Micro-channel Feature
Channel Width Range	≥ 10 µm
Channel Height Range	≤ 300 µm
Channel High Aspect Ratio	≤ 3
Channel Dimension Tolerance	±10%
Channel Surface Roughness	5-10 nm (Ra)
Complex Features	Multiple depths on a single layer
Chip Bonding Techniques
Bonding Process Available	Ultrasonic welding, laser welding, thermal fusion and adhesive
Alignment Tolerance	Typical +/- 10 µm
Multiple Layer Capability	Typical 2-Layer and 3-Layer
Surface Treatment Option
Hydrophilic Treatment	Yes, typical contact angle 10 to 30° (duration depends on process)
Hydrophobic Treatment	Yes
Fluorophilic	Yes
Other Features and Options
Chip Metalization	Electrodes or electronic connectors fabricated on chip
Micro Pillar Array	20 um < dimension < 100 um, ±15% tolerance
Manufacturing Capability
Manufacturing Capability Per Year	50, 000, 000 chips
Small Volume Option	10-2000 chips
Fabrication Turnaround Time	8-10 weeks (4-6 weeks for small volume)
ISO QC Certificate	ISO 9001, ISO 13485/GMP

Tags Microfluidic, Microfabrication, Injection Molding, Laser Micromachining