Precision Machining

Building a practical microfluidics system requires more than microfluidic devices/chips alone. Product development services can often involve the integration of fluidics and thermal management systems along with other technologies, such as electrodes, thin film heating elements and optic lens or other sensing elements.  According to the application requirements from customers, Aurora Pro Scientific will assist you from early stage research through to process controlled manufacturing of integrated microfluidic components and modules by selecting appropriate micro fabrication techniques and materials to realize the benefits of microfluidics. We provide:

  • Device design and prototyping
  • Contract device manufacturing 
  • Device metrology and QC 
  • Full solution (including components and modules)
  • Fluidic interface design and manufacturing
  • Design for manufacturability, reliability and serviceability 

The options of substrate materials may include silicon, glass (fused silica, quarts, borosilicate and photosensitive glass), thermoplastics (table below), and hybrid materials (CaF2, stainless steel etc.). The fabrication techniques will be coined according to the design complexity and substrate material properties.  We provide both enclosed microfluidic chips and/or microfluidic layers for subsequent surface treatment.  Awesome Pricing and Flexibility on Small Quantities:  small volume manufacturing from a few to up to thousands of units is available before the transition to the large scale production.

Chip General Information
Standard Chip Size
75 mm x 25 mm x 1.5 mm
Chip Material Option
Thermoplastics (COC/COP, PC, PS, PP and PMMA)
Mold Minimum Feature Size
2 µm (diameter of inner corner)
Through-hole Size
Typical 0.5-0.8 mm
Micro-channel Feature 
Channel Width Range
≥ 10 µm 
Channel Height Range 
≤ 300 µm 
Channel High Aspect Ratio 
≤ 3
Channel Dimension Tolerance
Channel Surface Roughness 
5-10 nm (Ra)
Complex Features
Multiple depths on a single layer 
Chip Bonding Techniques
Bonding Process Available
Ultrasonic welding, laser welding, thermal fusion and adhesive
Alignment Tolerance 
Typical +/- 10 µm 
Multiple Layer Capability 
Typical 2-Layer and 3-Layer 
Surface Treatment Option
Hydrophilic Treatment
Yes, typical contact angle 10 to 30° (duration depends on process)
Hydrophobic Treatment
Other Features and Options
Chip Metalization 
Electrodes or electronic connectors fabricated on chip 
Micro Pillar Array
20 um < dimension < 100 um, ±15% tolerance 
Manufacturing Capability
Manufacturing Capability Per Year
50, 000, 000 chips
Small Volume Option 
10-2000 chips
Fabrication Turnaround Time
8-10 weeks (4-6 weeks for small volume)
ISO QC Certificate 
ISO 9001, ISO 13485/GMP 

Tags Microfluidic, Microfabrication, Injection Molding, Laser Micromachining