Tergeo series plasma cleaners are tabletop laboratory plasma cleaners with versatile functions for wide range of applications, such as plasma etching, cleaning and surface treatment. There are two plasma sources in one machine,one i-situ plasma source and one remote plasma source.  The machines are built upon the technology developed at the Plasma and Ion Source Technology group in Lawrence Berkeley National Laboratory. The unique plasma sensing technology for quantitative plasma strength measurement ensures repeatable and consistent results in scientific and industrial production applications. In addition, the Tergeo series plasma cleaners have intuitive touchscreen user interface with fully automatic operation and advanced process control technology such as plasma sensor, digital pressure sensor and automatic flow control with mass flow controller.  They support  as many as 20 custom recipes.

• Better plasma uniformity with external electrode design
• Mass flow controller (MFC) regulated gas input instead of manual rotameter or coarse needle valve
• Direct immersion mode and downstream plasma processing mode in one system
  
• Fully automatic operation with stored 20 recipes
• Cleaning modes: Immersion plasma cleaning for high speed etching and surface modification; remote plasma cleaning for gentle surface contamination removal, such as SEM/TEM sample cleaning; pulsed operation to generate plasma with average RF power less than 0.5 watt for extremely delicate samples.
• Operation methods: Automatic recipe execution; automatic job sequence execution; manual operation.
• Plasma sensor: dual plasma strength sensor monitors in-situ plasma source and remote plasma source. Plasma strengths are displayed on the LCD touchscreen in real-time.
• Advanced process control capabilities: pressure sensor, temperature sensor, gas flow rate meters in mass flow controller (MFC), dual plasma strength sensors, automatic impedance matching
• External RF electrode and quartz chamber eliminates metal contamination on plasma systems with internal metal electrodes
  
• Quartz chamber: Enhanced chemical resistance and reduction of alkali impurities (Ca, K, Na) found in Pyrex glass

Typical Applications

• Wire bonding, flip chip underfill, device encapsulation and decapsulation
• SEM/TEM sample cleaning for carbonaceous contamination removal and oxide reduction
• Optics, glass and substrate cleaning before epoxy bonding
• Photo-resist ashing, descum and silicon wafer cleaning
• Surface modification or bonding of PDMS, microfluidics, glass slides and lab-on-a-chip
• Improve bonding for metal to metal or composite
• Improve bonding for plastic, polymer and composite materials