The glass microfluidic chips have channel patterns to form flow networks prepared by using standard photolithography and wet chemical etching. Two layers are attached together by thermal fusion bonding (less than 100-200 °C) after appropriately aligning the two contact layers.   Low-temperature glass bonding allows fabricating chips with temperature-sensitive materials, such as waveguides or chemical arrays.  Inlet and outlet ports are drilled by using appropriate diamond drill bits.  Standard glass wafer (Borofloat 33) thickness includes 0.7 mm, 1.0 mm and 1.5 mm; other options may be available upon request.  

Key Features

• Optical transparency and high visibility 
  
• Excellent chemical compatibility
• High bonding strength
• Negligible channel deformation during bonding  
  
• Operating pressure  up to 100 PSI
• Etched channel surface roughness (Ra): 5-10 nm
• Flexible for chip post-processing such as hydrophobic or fluorophilic  coating
• Multiple channel depths on a single glass layer 
  
• Quick and easy to connect/disconnect

Typical Applications

• Microfluidic devices 
• Optofluidics in medical applications 
• Analytical instruments 
• Biosensors