Tergeo-EM plasma cleaner is a special edition of Tergeo series plasma cleaner designed for SEM/TEM sample cleaning application. It replaces the quartz window in standard Tergeo plasma cleaner with a stainless steel adapter that can accept two TEM sample rods from different TEM vendors. Pin-mount SEM sample holders can be placed on the internal quartz plate for cleaning. The unique plasma sensing technology for quantitative plasma strength measurement ensures repeatable and consistent results in scientific and industrial production applications.

Key Features

Better plasma uniformity with external electrode design
Mass flow controller (MFC) regulated gas input instead of manual rotameter or coarse needle valve
Direct immersion mode and downstream plasma processing mode in one system
Fully automatic operation with stored 20 recipes.
Cleaning modes: Immersion plasma cleaning for high speed etching and surface modification; remote plasma cleaning for gentle surface contamination removal, such as SEM/TEM sample cleaning; pulsed operation to generate plasma with average RF power less than 0.5 watt for extremely delicate samples.
Operation methods: Automatic recipe execution; automatic job sequence execution; manual operation.
Plasma sensor: dual plasma strength sensor monitors in-situ plasma source and remote plasma source. Plasma strengths are displayed on the LCD touchscreen in real-time.
Advanced process control capabilities: pressure sensor, temperature sensor, gas flow rate meters in mass flow controller (MFC), dual plasma strength sensors, automatic impedance matching
External RF electrode and quartz chamber eliminates metal contamination on plasma systems with internal metal electrodes
Quartz chamber: Enhanced chemical resistance and reduction of alkali impurities (Ca, K, Na) found in Pyrex glass

Typical Applications

Wire bonding, flip chip underfill, device encapsulation and decapsulation
SEM/TEM sample cleaning for carbonaceous contamination removal and oxide reduction
Optics, glass and substrate cleaning before epoxy bonding
Photo-resist ashing, descum and silicon wafer cleaning
Surface modification or bonding of PDMS, microfluidics, glass slides and lab-on-a-chip
Improve bonding for metal to metal or composite
Improve bonding for plastic, polymer and composite materials

Input Voltage	110-230 VAC, universal power input
Pumping Port	NW/KF25
Pumping Speed	≥1 cfm
Ultimate Pressure	≤200 mTorr
User Interface	7-inch resistive touchscreen, touch with fingers, no stylus required
Chamber Material	Aluminum flange and high-purity quartz tube
Stainless Steel Chamber Dimensions	110 mm ID, 120 mm OD, and 280 mm in length
Sample Holder	High-purity quartz plate with 2 mm in thickness
External RF Antenna	Reducing metal sputtering found in plasma cleaners with internal metal electrodes
RF Power Supply	13.56 MHz RF Automatic impedance matching for in-situ plasma source Generating high-density plasma
RF Power	Two options: 0 - 75 W and 0 - 150 W
Gas Input	0 - 100 sccm with three mass gas flow input ports one port for venting and purging 1/4 inch inch Swagelok compression fitting connectors