This product is a cost-effective compact size vacuum spin coater designed for precise and uniform deposition of thin films and coatings. The vibration-free and portable design makes it a versatile tool for either R&D or development uses. For example, it can be installed in a glovebox or in a fume food. It carries with a oil-free vacuum pump with low noises. This spin coater can be used to deposit metal oxide thin films, polymer coatings and metal organic thin films.

Key Features

General Design Feature

5 Spin programs with 5 steps for each program
Wafer size: 10 mm to 4'' (100 mm)
Anodic oxidation aluminum shell
Anti-blockage spindle design for easy maintenance
Easy to clean the spin bowl which is removable

Safety and Reliability

Compact size
Vacuum interlock
Hinged spin bowl lid design

Chemical Compatibility

Removable spin bowl
Solvent resistant transparent lid
Chemical resistant spin bowl

Programable Mode

Intuitive LCD screen
Can program up to 5 recipes and 5 steps each recipe

Typical Applications

Semiconductor process
Patterning,
Coating process
Photolithography

Spin Coater
Chamber Size	135mm
Max Wafer Size	4 inches (100mm)
Vacuum Chuck	3 Pieces included (Diameter: 8 mm; 15mm; and 55mm)
Spin Speed	100-9999 RPM
Spin Control	Programmable Control (5 modes) and Recipe Restore
Spin Control Resolution	1 RPM
Equipment Power	110-230VAC, 50/60Hz
Equipment Dimension	250 mm (L) x 210 mm(W) x 200 mm (H)